Interfacial Engineering to Boost Performance and Reduce Hysteresis for Carbon-Based Planar Perovskite Solar Cells via CuSCN Incorporation
Yang Yang a b, Hongxia Wang a b
a School of Chemistry, Physics and Mechanical Engineering, Queensland University of Technology (QUT), Australia, George Street, 2, Brisbane City, Australia
b Queensland University of Technology, Center for Materials Science, Brisbane, Brisbane, Australia
Online Conference
Proceedings of International Conference on Advanced Light Absorbing Materials for Next Generation Photovoltaics (ABSOGEN)
Online, Spain, 2020 November 17th - 18th
Organizers: Hongxia Wang, Xiaojing Hao and Lydia Wong
Poster, Yang Yang, 019
Publication date: 6th November 2020
ePoster: 

Perovskite solar cells with carbon electrode (C-PSCs) have shown great potential to achieve their commercial application owning to the merits of low cost and high stability. However, the planar C-PSCs always suffer from issues such as poor interfacial contact with adjacent layer, severe hysteresis behaviour observed in J-V plot and low power conversion efficiency (PCE). Herein, an effective method is used to solve the above problems by interfacial engineering of introducing CuSCN into the devices. Two types of CuSCN-assisted C-PSCs were designed by either inserting the ultrathin CuSCN layer between perovskite and carbon film (named as PSK/CuSCN/C) or by filling the mesoporous carbon film with CuSCN solution (named as PSK/C-CuSCN). The effect of CuSCN on efficiency, hysteresis and stability for C-PSCs were investigated by analysing the energy alignment and the kinetics of interfacial charge transfer and hole trap-state density. Due to the improved interfacial charge carrier extraction, suppressed carrier recombination and reduced trap-state density, a PCE of 13.6% (and 13.4%) with the negligible hysteresis was achieved in PSK/CuSCN/C (and PSK/C-CuSCN). In addition, the CuSCN-incorporated devices also exhibited robust resistance to moisture with the performance retention of 98% (PSK/CuSCN/C) and 91% (PSK/C-CuSCN) after being stored at high humidity (RH% = 75-85%) for 10 days and superior long-term stability with the almost changeless PCE over 90 days stored in air (RH% =30-35%) without encapsulation. 

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