Liquid Metal Melt Electrodes for Low-cost Perovskite Solar Cells
Elizaveta Vaneeva a b, Sergey Tsarev b, Pavel Troshin b c
a D. Mendeleev University of Chemical Technology of Russia, Russian Federation
b Skoltech - Skolkovo Institute of Science and Technology, Moscow, Bolshoy Boulevard 30, Moskva, Russian Federation
c The Institute for Problems of Chemical Physics of the Russian Academy of Sciences RAS, Russia, Semenov Prospect 1, Russian Federation
Proceedings of Online School on Hybrid, Organic and Perovskite Photovoltaics (HOPE-PV)
Online, Spain, 2020 November 3rd - 13th
Organizers: Sergey M. Aldoshin, Jovana Milic, Keith Stevenson and Pavel Troshin
Poster, Elizaveta Vaneeva, 029
Publication date: 23rd October 2020
ePoster: 

Perovskite solar cells (PSCs) represent a promising emerging technology for solar energy harvesting.1 PSCs have such main advantages as solution processibility, excellent scalability using roll-to-roll printing and coating technologies and hence potential for ultralow cost. Currently, efficient laboratory PSC architectures typically use thermally evaporated top metal contacts. However, the thermal evaporation method is energy and time consuming and technologically less promising. In this regard, the development of vacuum-free and low-cost techniques for the top electrode deposition is essential for the future commercialization of the perovskite PV technology.

Herein, we present a simple method of electrode deposition in p-i-n PSCs using low melting point alloys. We proposed to use top electrodes based on Wood`s metal, which is an alloy with the melting point of 72°C. Using contact angle measurements of the liquid metal droplets deposited on standard charge-transport layers, we found that phenyl-C61-butyric acid methyl ester (PCBM) has the best adhesion to metal. This finding suggested that p-i-n device architecture such as ITO/PTAA/Cs0.12FA0.88PbI3/PCBM/metal electrode can be used for testing our hypothesis.

As a proof of concept, we used a simple lamination of Wood’s metal foils on top of the ITO/PTAA/Cs0.12FA0.88PbI3/PCBM stack. After some optimization of the processing parameters, the champion devices with laminated metal electrodes delivered power conversion efficiencies up to 15%, which is comparable with the characteristics of the conventional device architecture using evaporated Mg/Ag top electrodes (Figure 1). Our facile lamination process enables a simple and technologically relevant SC fabrication process without using vacuum-based or high temperature material deposition stages. Furthermore, it is compatible with modern printing techniques and, therefore, is promising for large-area applications leading to significantly reduced cost of the final product.

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