Publication date: 15th December 2025
Recent breakthroughs in vacuum-based thin-film engineering have unlocked a new generation of fully evaporated perovskite solar cells (PSCs) and photodetectors (PDs) that combine high performance with exceptional uniformity, stability, and manufacturability. By leveraging precisely tuned co-evaporation and buried-interface engineering, we achieve ultrathin, pinhole-free perovskite layers with remarkably low dark current density, a broad linear dynamic range, and outstanding imaging uniformity—key attributes for next-generation multispectral imagers and scalable photovoltaic modules.
Our latest advances demonstrate all-vacuum-deposited hybrid PSCs incorporating a bipolar-host-modified CuPc interface, delivering sustained operational stability with T₁₀₀ > 400 h under continuous illumination [1]. We further uncover how buried-interface energetics dictate crystallization, suppress non-radiative recombination, and govern photostability in vapor-deposited perovskites [2]. Importantly, our all-inorganic vacuum-evaporated perovskites with a 0D passivation architecture enable >42% indoor power conversion efficiency at 600 lux (TLD 840), highlighting their transformative potential for self-powered IoT and low-light energy-harvesting systems.
In parallel, our fully evaporated PDs on ITO achieve a specific detectivity of ~1013 Jones in the visible region [3], surpassing conventional Si-based detectors and showcasing the competitiveness of vacuum-grown perovskite optoelectronics for high-sensitivity, low-noise imaging. This presentation will highlight an integrated roadmap for vacuum-processed perovskite electronics—from fundamental physics and interface design to scalable device architectures—revealing a unified platform capable of powering future energy-harvesting systems and enabling ultra-low-light detection across large areas.
The speaker sincerely thanks the National Science and Technology Council for their generous financial support (Grant Nos. NSTC-113-2221-E-131-021-MY3, NSTC-113-2622-E-131-009, NSTC-112-2622-E-131-006, and NSTC 114-2222-E-131-004). The corresponding author, S.-W. Liu, deeply appreciates the invaluable contributions of Mr. Hsueh-Hsien Wu from Syskey Technology Co., Ltd. (Taiwan) in the design of the fabrication chambers, which played a critical role in advancing this work. The authors also gratefully acknowledge the financial support provided by Chang Gung University (Grant No. URRPD2N0011) and Ming Chi University of Technology’s Formosa Center (Grant No. FM002-113), which were pivotal to the successful completion of this research.
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