Building modular 2D systems though nanocrystal assembly and surface exchange.
Christopher B. Murray a b, Yaoting Wu a, Siming Li c, Blaise Fleury a, Stan Najmr a, Natalie Gogtsi b, Cherie R. Kagan a b d, Jason B. Baxter c
a Department of Chemical & Biological Engineering, Drexel University
Materials for Sustainable Development Conference (MATSUS)
Proceedings of nanoGe September Meeting 2017 (NFM17)
SE2: Opto-electronics of 2-D Nanostructured Semiconductors: Parabolic vs. Linear Dirac Bands
Barcelona, Spain, 2017 September 4th - 9th
Organizers: Daniel Vanmaekelbergh and Cherie Kagan
Invited Speaker, Christopher B. Murray, presentation 135
Publication date: 20th June 2016

Colloidal nanocrystals (NCs) with controlled composition, size, and shape and surface functionalization provide ideal building blocks for the assembly of new 2D materials and devices. Monodisperse colloidal NCs serve as "artificial atoms" with tunable electronic, and optical properties that can be assembled on the “Mesoscale” to yield properties that combine the best attributes of the isolated quantum systems and the extended electronic transport of traditional semiconductor thin films. In this talk, we will briefly outline progress in synthesis, purification, and integration of size and shape controlled single phase NCs as well as core-shell and heterostructure NCs into 2D arrays through liquid air interfacial assembly and scalable dipcoating processes. Chemical tailoring of NC shape and ligand structure can program the assembly of NC 2D sheets and thin films. The coupling between the NC building blocks can be modified further by exchange of the surface stabilizing ligands to direct the orientation and linking of neighboring NCs. The modular assembly of these NCs allows the desirable features of their underlying quantum character to be retained, or even enhanced by the interactions between the NCs and the hybridization drives the emergence of new delocalized properties.The electronic and optical properties of these coupled systems will be probed through a combination of direct electrical and non-contact optical techniques. Progress in devices and circuits based on these will be shared.

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