Gold conductive ink formulation with enhanced cohesion for flexible printed electronics
Christopher Tuck a, Ricky Wildman a
a Faculty of Engineering University of Nottingham, Nottingham NG7 2RD, Nottingham, United Kingdom
Proceedings of nanoGe Fall Meeting 2021 (NFM21)
#NanoPrint21. Engineered Nanomaterials and Inks for Printed, Flexible and Interfacial Electronics
Online, Spain, 2021 October 18th - 22nd
Organizers: Shweta Agarwala and Victor Sans Sangorrin
Invited Speaker, Christopher Tuck, presentation 259
Publication date: 23rd September 2021

Ligand-functionalised gold nanoparticles, AuNPs, are promising conductive ink materials for printed electronics since they provide good dispersion in organic solvents, long shelf-life at ambient conditions, good printability and electrical conductivity after sintering. However, their mechanical and electrical performance degradation under external mechanical deformation often occurs due to the failure of the stress redistribution at microcracks and pores formed within printed structures, which limits their application for flexible electronics. Here, we employ a thiol-terminated additive as a cohesion enhancer in a gold conductive ink formulation to prevent the formation of microcracks and pores arising from the increased surface energy of nanoparticles during drying and sintering processes. The gold ink formulation with the cohesion enhancer exhibits high electrical conductivity of 5.3´106 S/m and electrical performance stability under mechanical deformation for a single printed layer due to the enhanced cohesion compared to the formulation without the cohesion enhancer, which offers exciting potential for their application in flexible electronics.  

© Fundació Scito
We use our own and third party cookies for analysing and measuring usage of our website to improve our services. If you continue browsing, we consider accepting its use. You can check our Cookies Policy in which you will also find how to configure your web browser for the use of cookies. More info