Flexible perovskite photovoltaics - device engineering towards industrial reality
Konrad Wojciechowski a b
a Saule Research Institute, Duńska 11, 54-427, Wrocław, Poland
b Saule Technologies, Wroclaw, Poland
Materials for Sustainable Development Conference (MATSUS)
Proceedings of MATSUS Spring 2024 Conference (MATSUS24)
#SusPer - Sustainability of halide perovskites
Barcelona, Spain, 2024 March 4th - 8th
Organizers: Francesca Brunetti and Iris Visoly-Fisher
Invited Speaker, Konrad Wojciechowski, presentation 109
DOI: https://doi.org/10.29363/nanoge.matsus.2024.109
Publication date: 18th December 2023

Metal halide perovskites constitute a very attractive class of materials for optoelectronic applications, including solar cells, light-emitting diodes, lasers, and photodetectors. Most notably, solid-state photovoltaic devices have reached a power conversion efficiency (PCE) of 26% within only a decade of academic research.

In my talk I will discuss the special case of perovskite PV technology, focusing on devices made on flexible substrates, outlining industrial opportunities of this technology, with new value propositions and market versatility. One of the exceptional features of metal halide perovskites is bandgap tunability in a broad spectral range, which enables the facile fabrication of multijunction all-perovskite PV systems. I will address the topic of all-perovskite tandems, discussing the challenges of scalable production.

Moreover, I will provide insight into physical processes occurring during solar cell operation, especially at the interfaces with charge selective contacts, where most of the performance losses take place. Importantly, these non-optimal operations have a major influence on the long-term device reliability. Systematic interfacial engineering, combined with spectroscopic characterization of recombination losses, can lead to significant improvements in performance and stability. I will demonstrate flexible perovskite solar cells successfully passing IEC-based accelerated aging tests, where device engineering was complemented with robust flexible packaging.

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