Memristor Structures Based on Amorphous Silicon with a Zirconium Oxide Layer Formed by Magnetron Sputtering
Dmitry Ichyotkin a b, Ilya Zadiriyev a c, Konstantin Chernoglazov a, Mikhail Sapozhnikov d, Igor Pashenkin a d, Vyacheslav Demin a, Vladimir Rylkov a e
a National Research Center «Kurchatov Institute», 123182 Moscow, Russia
b Moscow Institute of Physics and Technology (National Research University), 141700 Dolgoprudny, Russia
c Lomonosov Moscow State University, 119991 Moscow, Russia
d Institute for Physics of Microstructures RAS, 603950 Nizhny Novgorod, Russia
e Fryazino Branch of the Kotelnikov Institute of Radio Engineering and Electronics of the Russian Academy of Sciences, Fryazino, 141190 Moscow Region, Russia
Proceedings of Neuronics Conference 2026 (Neuronics26)
Seoul, Korea, Republic of, 2026 September 8th - 10th
Organizers: Valeria Bragaglia and Seyoung Kim
Oral, Dmitry Ichyotkin, presentation 001
Publication date: 24th July 2026

Memristive devices are promising candidates for next‑generation non‑volatile memory and synapse modeling in neuromorphic systems due to their simple structure, scalability, and low power operation [1]. Among various material systems, hybrid structures combining electrochemical metallization (ECM) and valence change memory (VCM) mechanisms offer enhanced control over resistive switching (RS) [2]. In this work, we present Ag/Cu‑Ag/a‑Si/ZrO2:Y2O3/p++‑Si memristors synthesized by magnetron sputtering, where a thin (6 nm) yttria‑stabilized zirconia barrier layer is inserted between amorphous Si and the p++‑Si substrate.

At the initial stage, we also fabricated barrier layers of magnetron SiOx (Si deposited in DC mode in oxygen), but ZrO2:Y2O3 demonstrated superior reproducibility and stability, so further studies focused on this material [3]. The a‑Si layer (≈5 nm) acts as a host for cations Ag⁺/Cu⁺ diffusion, which provides the formation of alloy nanochannels that determine the switching positions in zirconium oxide. Under bias, Ag⁺/Cu⁺ ions migrate through a‑Si and create metallic nanochannels, whereas oxygen vacancies in ZrO2:Y2O3 form the filaments, yielding a hybrid ECM–VCM switching mechanism.

The devices exhibit multilevel resistive switching with set voltages Uset=2.9 ± 0.3 V and low compliance currents Icc = 0.2–0.5 mA (Fig. 1). The ON/OFF resistance ratio reaches Roff/Ron ≈ 900 ± 150, and the device‑to‑device dispersion D2D < 16% across three fabrication batches. High‑resistance ON states (~50 kΩ) are particularly important for energy‑efficient 1T1R memory arrays.

These results demonstrate that a‑Si/ZrO2:Y2O3 heterostructures combine reliable current limiting, controlled ion migration, and high batch‑to‑batch reproducibility, making them suitable for transistor‑controlled 1T1R memory at megabit scales and for neuromorphic applications. Future work will focus on BEOL integration and fabrication of crossbar arrays.

The work was financially supported by the Russian Science Foundation grant No. 25-19-90201.

Memristor, amorphous silicon, zirconium oxide, magnetron sputtering, resistive switching, 1T1R memory.

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